搜索结果: 1-9 共查到“知识库 电子技术 3D”相关记录9条 . 查询时间(0.171 秒)
In this paper we present a framework for the rendering of dynamic 3D virtual environments which can be integrated in the development of videogames. It includes methods to manage sounds and particle ef...
Aircraft artificial horizon with interface to 3D Android application
Six axis spacecraft attitude indicator the operating system microprocessor tools mixer
2014/12/31
The goal of this project is to provide a 6-axis Aircraft Attitude Indicator solution based on Android OS and cutting edge MPU-6000 chip by Invensense. Mentor Graphics emerging Inflexion UI technology ...
Effect of Clock and Power Gating on Power Distribution Network Noise in 2D and 3D Integrated Circuits
Supply Noise Power Gating Clock Gating Wavelet Analysis Linear Programming Genetic Algorithm
2014/12/8
In this work, power supply noise contribution, at a particular node on the power grid, from clock/power gated blocks is maximized at particular time and the synthetic gating patterns of the blocks tha...
软分割约束边缘保持插值的半自动2D转3D
二维转三维 图割 随机游走 软分割
2017/1/4
半自动2D转3D将用户标注的稀疏深度转换成稠密深度,是解决3D片源不足的主要手段之一.针对现有方法利用硬分割增强深度边缘引入误差的问题,提出像素点与超像素深度一致性约束的边缘保持插值方法.首先,建立像素点深度和超像素深度传播的能量模型,通过像素点与所属超像素间深度差异的约束项将二者关联起来;其次,利用矩阵表示形式将两个能量模型的最优化转换成一个稀疏线性方程组的求解问题.通过超像素提供的约束项,可避...
中间绑定测试能够更早地检测出3D堆叠集成电路绑定过程引入的缺陷,但导致测试时间和测试功耗剧增.考虑测试TSV、测试管脚和测试功耗等约束条件,采用整数线性规划方法在不同的堆叠布局下优化中间绑定测试时间.与仅考虑绑定后测试不同,考虑中间绑定测试时,菱形结构和倒金字塔结构比金字塔结构测试时间分别减少4.39%和40.72%,测试TSV增加11.84%和52.24%,测试管脚减少10.87%和7.25%....
Electromagnetic radiation from multilayer printed circuit boards: a 3D FDTD-based virtual emission predictor
Electromagnetic Compatibility EMC EM Emission Printed Board
2010/1/11
A novel FDTD-based virtual electromagnetic compatibility tool for the prediction of electromagnetic emissions from a multilayer printed circuit board is introduced. Tests are performed with characteri...
PMD/OEP-Technologies for 3D-Imaging and Ultra-fast Analog and Digital OE- Multi-channel Signal Processing
PMD OEP Sensing and Mixing CMOS
2010/7/15
This paper introduces operation principles of the new semiconductor components of PMD (Photonic Mixer Device) and OEP (Opto-Electronic Processor), as well as their applications in different fields suc...
PMD/OEP-Technologies for 3D-Imaging and Ultra-fast Analog and Digital OE- Multi-channel Signal Processing
PMD OEP Sensing and Mixing CMOS
2010/7/15
This paper introduces operation principles of the new semiconductor components of PMD (Photonic Mixer Device) and OEP (Opto-Electronic Processor), as well as their applications in different fields suc...
Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56%
the Chemical Etching (h k 0) and (h h l) Silicon Plates a NaOH 35% Solution KOH 56%
2010/12/8
This paper deals with the micromachining of various (h k 0) and (h h l) membrane–mesa structures in a NaOH 35% solution. Final etching shapes of micromachined structures show a marked anisotropy of ty...