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Two thick film flat-type inductive sensors are described and tested for distance and profile measurement. The first one is a single-layer spiral while the second one is a multi-layer structure consist...
The realisation of microwave integrated circuits consisting of numerous elements and components, both passive and active, takes place in steps. Initially, experimental constituent elements are designe...
When using the well known handbooks for reliability predicting (MIL, CNET) some problems occur in quality assessment of components which are not produced according to the requirements of the US milita...
In this paper the results of miniature thick film resistors designed as add-on lumped resistors are presented. A few resistor configurations have been elaborated and tested, and a specific trimming re...
A Technology file for the Magic layout editor has been developed in order to enable thick film circuit designers to evolve fast solutions for layout with design rule checking, and plotting of the mask...
A performance comparison of microstripline circuits using thin and thick film techniques has been studied, in which a Microstrip rejection filter, in the X-band of microwaves, is used as test circuit....
Though for many decades have we had thick-film resistors (TFRs) with good electrical properties, no well established model for describing their conduction mechanisms has been achieved. However the eff...
The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered t...
The metal gauze screen provided with the mask must have a flat surface (roughness < 5/μm) and an even thickness and gauze tension. For a number of inks the viscosity at low shear-rates defines the fin...
The applicability of the various copper compositions to the production of thick-film microwave devices has been examined. The results of this work are presented in this paper. The paper presents crite...
Thick film technology has been known for about 20 years. The technique of inks, printing, firing and trimming has grown in this time to a well established state of the art. This paper gives an overvie...
Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting the gauges to amplifiers in electronic pressure and differential pressure transmitters...
Electronic circuits for industrial uses must satisfy the following requirements: low sensitivity to changes in the surrounding temperature, high reliability, and small size. In the amplifier for a pre...
The purpose of this study was to investigate the effect of some air abrasive trim cuts on the current noise of thick film resistors. It was found that the current noise changed on trimming the resisto...
The use of thick film passive networks and hybrid integrated circuits by the Bell System is described in this paper. Included is a discussion of how attributes of thick films such as a large resistanc...

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