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The micropower CMOS implementation of the three basic components of switched capacitor circuits is discussed. Switches must be carefully designed to allow low voltage operation and compensation of clo...
A hybrid circuit using a custom-designed I2L IC for a four-channel implantable biotelemetry system together with a HF transmitter has been designed. It realises a high-performance and economical devic...
The paper includes temperature measurement results on hybrid microelectronic circuit surfaces carried out by infrared microscope with special attention to critical temperatures (hot spots) which may r...
Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting the gauges to amplifiers in electronic pressure and differential pressure transmitters...
Gold paste of the mixed bond type was recognized as superior in adhesion to alumina substrate, while that of the fritless type was found superior in adhesion to the fired dielectric paste and wire bon...
A new method for fabricating high density printed circuit boards has been investigated. The procedure used for photoselective metal deposition on the substrate consists of five steps: adhesion treatme...
In the 1970's, much development occurred in monolithic IC's and automatic insertion machines, which brought about extensive changes among mass producers of electronic consumer products and greatly inf...
A series of air-firing base metal resistor pastes which yield resistors with properties comparable to those of conventional precious metal thick film resistors has been developed. The pastes can be po...
The demand for greater complexity in hybrid circuits requires new techniques to be applied to the production of artwork. The paper discusses the use of a high precision pattern generator and the relev...

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