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Quality Evaluation of Diffusion Bonded Joints by Electrical Resistance Measuring and Microscopic Fatigue Testing
diffusion bonded joints interfacial failure electrical resistance
2011/8/4
Micro-structure related behavior of diffusion bonding joints is a crucial issue in device and reactor fabrication of Micro Chemo Mechanical Systems. However, the previous studies have been focused on ...
Defect Density and Electrical Properties of Vacuum Evaporated Copper Films From Annealing Studies of Electrical Resistance
Defect Density Electrical Properties Vacuum Evaporated Copper Films Electrical Resistance
2010/12/28
Copper films (210 – 1650 Å) were deposited onto glass microslides by vacuum evaporation. The films were subjected to heat treatment at a constant rate and the variation of electrical resistance ...