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The Prospect of 3D-IC
Prospect 3D-IC
2015/8/17
Three-dimensional integrated circuits (3D-ICs) have been studied since the 1980s [1]. However, scaling in accordance with Moore’s Law has been the most cost-effective means to increase the packing den...
台湾工研院与应用材料共同开发3D IC核心工艺
台湾工研院 应用材料 3D IC核心工艺
2009/12/18
全球首座3D IC实验室预计将在明年年中登场，中国台湾工研院与美商应用材料公司(Applied Material)宣布进行3D IC核心制程的客制化设备合作开发。这个弹性的开放制程平台，将整合3D IC的主流技术穿透硅通孔(Through-silicon Vias，TSV)制程流程，缩短集成电路及芯片开发时间，协助半导体厂商迅速地将先进芯片设计导入市场，进而大幅降低初期投资。